A new solar panel reaches up to 865 W, setting a historic record in power and efficiency for large-scale solar projects.

Abstract: The parasitic inductance and dynamic current sharing performances of multichip silicon carbide power module packaging limit the device's performance. Moreover, high electrical properties ...

The new power amplifier module (PAM) from NEC Corporation is a compact, high-efficiency PAM for the sub-6GHz band designed ...

In MCU-based projects, this design uses a single push button to switch on and switch off 5-V and 15-V supplies in sequence.

The MCPF1525 is packaged in an innovative vertical construction that maximizes board space efficiency and can offer up to a 40% board area reduction when compared to other solutions. The compact power ...

As Tesla CEO Elon Musk pleaded for more battery infrastructure in America, we toured Porsche’s incredibly advanced Smart ...

Discover how to create a wearable kinetic energy power bank in this hands-on DIY electronics project. Follow step-by-step ...

A new wave of price increases is expected to hit the global solar industry following a major policy shift by China, the world ...

LEO3E is an extension of the existing high performance compute cluster LEO3 of the Research Area Scientific Computing at the University of Innsbruck, financed by the Research Area Scientific Computing ...

Unlock the power of touch! In this deep-dive tutorial, we’re moving beyond clunky mechanical switches and harnessing the ...

When you’re testing or debugging some mains-powered gear, plugging it directly into the outlet can often be an exciting ...

Abstract: Advanced packaging solutions for wide bandgap power devices, such as silicon carbide (SiC) MOSFETs, can help realize their full potential. Additively printed electronics present a promising ...