No part of a product life cycle is immune to time-to-market pressures, and that includes wafer-level parametric tests on scribe-line test structures. Parallel parametric test is emerging as a ...

Today’s devices are required to pass thousands of parametric tests prior to being shipped to customers. A key challenge test engineers face, in addition to optimizing the number of tests they run on ...

Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...